I am a Ph.D student from RF & Microwave Research Group at University College Dublin (UCD), supervised by Prof. Anding Zhu. I received my B.E. and M.E. degrees from South China University of Technology (SCUT), Guangzhou, China, in 2019 and 2022, respectively.

My current research interests include integrated high-efficiency power amplifier (PA) design, and next-generation transmitter design.

🔥 News

  • 2025.06:  🎉🎉 I received the 2025 IEEE Microwave Theory and Technology Society (MTT-S) graduate fellowship!

📝 Publications

Journal Articles

A 24-to-30-GHz GaN MMIC Doherty Power Amplifier Using Reduced Peaking Intrinsic Output Impedance for Bandwidth Extension

Ruijia Liu; Haoyang Jia; Lin Qi; Anding Zhu

Project

  • This presented a millimetre-wave gallium nitride (GaN) monolithic microwave integrated circuit (MMIC) Doherty power amplifier (DPA) for 5G-NR applications. The bandwidth of the DPA is extended by reducing the intrinsic output impedance of the power-stage peaking transistor at the back-off by selecting a proper gate bias voltage.

An Ultracompact Bidirectional CMOS Gate-Switching Cascode Amplifier for Millimeter-Wave Transceiver Front End

Haoyang Jia, Lingtao Jiang, Xiu Yin Zhang, Yanjie Wang, Anding Zhu

Project

  • This work proposed an ultra-compact single-channel bidirectional amplifier architecture. The bi-directional gate-switching cascode amplifier is leveraged in TRX front end to reduce the leakage current in transmitting (TX) and receiving (RX) mode to enhance system performance with an ultra-compact size.

A 26-GHz GaN MMIC load-modulated balanced amplifier with miniaturized dual-loop coupler

Haoyang Jia; Ruijia Liu; Qian Wu; Anding Zhu

Project

  • This work proposed the miniaturized dual-loop (MDL) coupler that reduced the chip area while ensuring good isolation without compromising the load modulation of the LMBA. The miniaturized coupler facilitates the implementation of millimeter-wave LMBA in monolithic microwave-integrated circuits (MMICs).

Conference Papers

🎖 Honors and Awards

  • 2025.06 IEEE Microwave Theory and Technology Society (MTT-S) Graduate Fellowship
  • 2021.06 Chinese National scholarship
  • 2021.05 First prize, Chinese National Integrated Circuit Innovation and Entrepreneurship Competition (1st Place)
  • 2021.03 Second price, The 16th China Postgraduate Electronic Design Competition South China Division
  • 2018.06 First Prize, Electronic Design Competition of Guangdong Province, China

📖 Educations

  • 2022.09 - present, Ph.D. in Electronic Engineering, University College Dublin, Dublin, Ireland (Advisor: Prof. Anding Zhu).
  • 2019.09 - 2022.06, Master in Integrated Circuit Engineering, South China University of Technology, Guangdong, China (Advisor: Prof. Yanjie Wang).
  • 2019.09 - 2022.06, Bachelor in Electronic Science and Technology, South China University of Technology, Guangdong, China.

💻 Work Experience

  • 2022.06 - 2022.09, Senior RFIC Engineer, ZEKU, Shanghai, China.
  • 2020.01 - 2022.05, mm-Wave IC Engineer (Internship), Jelicomm, Shenzhen, China

💬 Skills

  • Strong CAD design skills in Cadence Virtuoso, HFSS, ADS Momentum.
  • RF&MM-Wave Measurement skills: VNC, PNA Network Analyzer, Spectrum Analyzer, Power Sensor/Meter, Signal Generator, Power Supplies, Waveform Generator
  • Language: Mandarin (native), English (proficient)